|
| Brand Name: | Winsmart |
| Model Number: | SMTS11 |
| MOQ: | 1 set |
| Price: | USD1-10000/Set |
| Packaging Details: | Plywood case |
| Payment Terms: | L/C, T/T, Western Union |
Pulse Heat Bonding Machine FFC to PCB Hot Bar Soldering Equipment
Pulse Heat Bonding Machine Principle:
The hot bar power supply provide the current to heat the thermode which is high resistivity such as W,Mo,Ti. The temperature climb up to a certain value to melt theTIN and the solder, when the temperature drop down, the workpiece is connected by the TIN. A pressure is working through all the process and the temperature is accurately controlled by the IGBT inverter power supply.
Pulse Heat Bonding Machine Features:
1. According to different products, optional temperature for your choice.
2. Unique material thermode head, ensure the average pressure
3. Has vacuum function, easier for adjustment and positioning.
4. NC temperature, clear and high precision
5. With digital pressure gauge, pressure range can be preset.
6. Microcomputer control, high accuracy and stable.
7. Programmable curve Including pre-heating and reflow soldering temperature.
8. Suitable for all kinds of high density TAB, TCP and pressure to FPC, FFC and PCB soldering pressure welding.
9. Precise PID control, phase angle replace pulse drive.
10. Less Libration, less noise, avoiding voltage fluctuate
11. Real-time display temperature curve and temperature data.
12. Touch screen input data, simplify the operation.
Pulse Heat Bonding Machine Application:
For a variety of high density TAB, TCP crimping and FPC, FFC and PCB solder crimp.
Pulse Heat Bonding Machine Specification:
| Machine size | 590×640×620mm |
| Working area | Max 200*170mm |
| Machine weight | 89Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 40*3mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
Pulse Heat Bonding Machine FAQ:
Q: What is cycle time of soldering?
A: 5-15 seconds.
Q: Is there any special requirements?
A: Must apply solder paste on the pads before soldering.
Q: What is min pin pitch?
A: 0.15mm
Q: What is the material of thermode head?
A: Molybdenum alloy.
Q: How to maintain thermode head?
A: Please clean thermode head everyday and make sure its flatness by grinder.
|
|
| Brand Name: | Winsmart |
| Model Number: | SMTS11 |
| MOQ: | 1 set |
| Price: | USD1-10000/Set |
| Packaging Details: | Plywood case |
| Payment Terms: | L/C, T/T, Western Union |
Pulse Heat Bonding Machine FFC to PCB Hot Bar Soldering Equipment
Pulse Heat Bonding Machine Principle:
The hot bar power supply provide the current to heat the thermode which is high resistivity such as W,Mo,Ti. The temperature climb up to a certain value to melt theTIN and the solder, when the temperature drop down, the workpiece is connected by the TIN. A pressure is working through all the process and the temperature is accurately controlled by the IGBT inverter power supply.
Pulse Heat Bonding Machine Features:
1. According to different products, optional temperature for your choice.
2. Unique material thermode head, ensure the average pressure
3. Has vacuum function, easier for adjustment and positioning.
4. NC temperature, clear and high precision
5. With digital pressure gauge, pressure range can be preset.
6. Microcomputer control, high accuracy and stable.
7. Programmable curve Including pre-heating and reflow soldering temperature.
8. Suitable for all kinds of high density TAB, TCP and pressure to FPC, FFC and PCB soldering pressure welding.
9. Precise PID control, phase angle replace pulse drive.
10. Less Libration, less noise, avoiding voltage fluctuate
11. Real-time display temperature curve and temperature data.
12. Touch screen input data, simplify the operation.
Pulse Heat Bonding Machine Application:
For a variety of high density TAB, TCP crimping and FPC, FFC and PCB solder crimp.
Pulse Heat Bonding Machine Specification:
| Machine size | 590×640×620mm |
| Working area | Max 200*170mm |
| Machine weight | 89Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 40*3mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
Pulse Heat Bonding Machine FAQ:
Q: What is cycle time of soldering?
A: 5-15 seconds.
Q: Is there any special requirements?
A: Must apply solder paste on the pads before soldering.
Q: What is min pin pitch?
A: 0.15mm
Q: What is the material of thermode head?
A: Molybdenum alloy.
Q: How to maintain thermode head?
A: Please clean thermode head everyday and make sure its flatness by grinder.
Address
Liwu Industrial Park, Yuanzhou Town, Boluo County, Huizhou City, Guangdong Provice, China.
Tel
86-138-29839112
