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Brand Name: | Winsmart |
Model Number: | SMTS42 |
MOQ: | 1 set |
Price: | USD1-10000/Set |
Packaging Details: | Plywood case |
Payment Terms: | L/C, T/T, Western Union |
Optical Module Industrial Soldering Machine PCB Bonding Machine
Product Introduction:
Pulse soldering machine, pulse heated reflow soldering is a kind of process, two parts which are pre coated with flux and tinned are heated to a temperature enough to make the solder melt and flow. After curing, a permanent electrical mechanical connection is formed between the parts and the solder.
Working Principle:
A 2000W transformer is used to generate a large current with low voltage, which is heated rapidly through the welding joint. Pulse current refers to the on and off frequency ratio of current. The larger the pulse ratio is, the larger the current output is, and the faster the welding joint temperature rises.
Specification:
Machine size | 680×780×750mm |
Working area | Max 200*260mm |
Machine weight | 135Kg |
Working air pressure | 0.4-0.6Mpa |
Jig quantity | 2 |
Thermode head size | Max 80*5mm |
Welding precision | pitch 0.2mm |
Pressing time | 1~99.9s |
Temperature settings | RT~500℃ tolerance ±5℃ |
Welding pressure | 1~20Kg |
Temperature settings | Two |
Working environment | 10-60℃,40%-95% |
Power supply | AC220V±10% 50HZ,2200W |
Alignment mode | CCD + LCD Monitor |
Feeding mode | Manual |
Starting mode | Press start buttom |
Rotation Platform | Cylinder control,tolerance<0.02mm |
Machine Show:
Heat Sealing Paratmeter:
1. Temperature range: 50℃ to 600℃
2. Temperature accuracy: ±1°C
3. Bond timer: 0-12 seconds
4. Bond air pressure: 0.4-0.6MPa
5. Pressure accuracy: ±0.05MPa
6. Max bond force: 1100N
Applicable Area:
LCD Module, Solar Battery, Camera , Electronic Components, Coil / Inductor, Mobile Devices, PWB, Power Devices.
All where there need to be heated or fusing or joining or forming.
![]() |
Brand Name: | Winsmart |
Model Number: | SMTS42 |
MOQ: | 1 set |
Price: | USD1-10000/Set |
Packaging Details: | Plywood case |
Payment Terms: | L/C, T/T, Western Union |
Optical Module Industrial Soldering Machine PCB Bonding Machine
Product Introduction:
Pulse soldering machine, pulse heated reflow soldering is a kind of process, two parts which are pre coated with flux and tinned are heated to a temperature enough to make the solder melt and flow. After curing, a permanent electrical mechanical connection is formed between the parts and the solder.
Working Principle:
A 2000W transformer is used to generate a large current with low voltage, which is heated rapidly through the welding joint. Pulse current refers to the on and off frequency ratio of current. The larger the pulse ratio is, the larger the current output is, and the faster the welding joint temperature rises.
Specification:
Machine size | 680×780×750mm |
Working area | Max 200*260mm |
Machine weight | 135Kg |
Working air pressure | 0.4-0.6Mpa |
Jig quantity | 2 |
Thermode head size | Max 80*5mm |
Welding precision | pitch 0.2mm |
Pressing time | 1~99.9s |
Temperature settings | RT~500℃ tolerance ±5℃ |
Welding pressure | 1~20Kg |
Temperature settings | Two |
Working environment | 10-60℃,40%-95% |
Power supply | AC220V±10% 50HZ,2200W |
Alignment mode | CCD + LCD Monitor |
Feeding mode | Manual |
Starting mode | Press start buttom |
Rotation Platform | Cylinder control,tolerance<0.02mm |
Machine Show:
Heat Sealing Paratmeter:
1. Temperature range: 50℃ to 600℃
2. Temperature accuracy: ±1°C
3. Bond timer: 0-12 seconds
4. Bond air pressure: 0.4-0.6MPa
5. Pressure accuracy: ±0.05MPa
6. Max bond force: 1100N
Applicable Area:
LCD Module, Solar Battery, Camera , Electronic Components, Coil / Inductor, Mobile Devices, PWB, Power Devices.
All where there need to be heated or fusing or joining or forming.